• First GPS pavilion opens at sourcing fair (2006-09-29) [ Interface Design ]
• Hynix's Wuxi facility preps for DDR2 production (2006-09-29) [ Buffer/Storage ]
• Zigbee's improved spec incompatible with v1.0 (2006-09-29) [ RF/Wireless ]
• NXP set to increase stake in Singapore foundry (2006-09-29) [ Process/Manufacturing ]
• Despite ITU nod, China IPTV codec's future unclear (2006-09-29) [ Amplifying/Conditioning/Converting ]

• Lucent claims 100GbE over 2,000km (2006-09-29) [ Networking Design ]
• India to auction 3G spectrum (2006-09-29) [ RF/Wireless ]
• PWM buck controller requires minimal external circuitry (2006-09-29) [ Power Design ]
• CMOS IC targets automotive, mobile apps (2006-09-29) [ Digital Signal Processing ]
• Catalyst unveils new I/O expander (2006-09-29) [ Interface Design ]

• Freescale adds more choices to DSC products (2006-09-29) [ Digital Signal Processing ]
• ARM7-based MCUs from NXP tout dual high-speed buses (2006-09-29) [ Control Design ]
• Lattice offers free reference design for FPGAs (2006-09-29) [ Programmable Logic ]
• New CompactPCI boards are conduction cooled (2006-09-29) [ Embedded Systems ]
• TI floating-point DSP available for $5.75 (2006-09-29) [ Digital Signal Processing ]

• Technology enables "safer" notebook PC batteries (2006-09-28) [ Power Design ]
• PowerDsine signs distribution agreement with India's Anixter (2006-09-28) [ Networking Design ]
• Freescale, Aimetis partner on intelligent video solution (2006-09-28) [ Optical Electronics and Display ]
• IEEE meets to discuss 100Gbit Ethernet (2006-09-28) [ Networking Design ]
• China preps homegrown 3G tech (2006-09-28) [ RF/Wireless ]

• Intel reveals details on teraflop programmable processor (2006-09-28) [ Embedded Systems ]
• ADI exec sounds off on global engineering talent (2006-09-28) [ EDA/IC Design ]
• AMD, Intel face off on quad core (2006-09-28) [ Embedded Systems ]
• China's SMT equipment market to reach $3.5 billion in 2011 (2006-09-28) [ Process/Manufacturing ]
• Authorities raid Shenzhen factory for alleged trademark infringement (2006-09-28) [ RF/Wireless ]

• Electronics and components fair to feature 2,300 booths (2006-09-28) [ Interface Design ]
• Cypress to hold free seminars on PSoC Express software (2006-09-28) [ Programmable Logic ]
• Hitachi Metals makes 'smallest' acceleration sensor (2006-09-28) [ Sensor Technology ]
• Agilent unveils integrated tester for HDMI 1.3 (2006-09-28) [ Design Test ]
• Dual GPS/Galileo ICs clock in sub-second acquisition (2006-09-28) [ RF/Wireless ]

• PoE controller suits IP surveillance cameras, phones (2006-09-28) [ Power Design ]
• Mentor rolls out low-cost development tools (2006-09-28) [ EDA/IC Design ]
• Intel unveils dual-core processors for embedded apps (2006-09-28) [ Embedded Systems ]
• SAS solution achieves more than 3.2GBps throughput (2006-09-28) [ Buffer/Storage ]
• DIO card features multiple digital I/O channels (2006-09-28) [ Embedded Systems ]

• Avago unrolls new line of transmissive photointerrupters (2006-09-28) [ Sensor Technology ]
• Sixnet releases new IP67 industrial Ethernet accessories (2006-09-28) [ Networking Design ]
• Module replaces DCF in DWDM networks (2006-09-28) [ Networking Design ]
• Imsys releases RoHS-compliant SNAP modules (2006-09-28) [ Embedded Systems ]
• Baseband signaling ICs target global marine AIS market (2006-09-28) [ RF/Wireless ]

• 3.5-inch TFT-LCD targets consumer, industrial handhelds (2006-09-27) [ Optical Electronics and Display ]
• 10GBASE-LRM IC ups backbone coverage by 20% (2006-09-27) [ Networking Design ]
• Network multimedia coprocessor is video codec agnostic (2006-09-27) [ Amplifying/Conditioning/Converting ]
• Quad-channel UARTs come in three FIFO options (2006-09-27) [ Buffer/Storage ]
• Ceramic resonators tout 'tightest' tolerance (2006-09-27) [ Amplifying/Conditioning/Converting ]

• DC/DCs extend battery life in CDMA, WCDMA handsets (2006-09-27) [ Power Design ]
• Omron unveils 'first' commercial UWB MIMO antenna (2006-09-27) [ RF/Wireless ]
• RadioScape upgrades Professional Broadcast System (2006-09-27) [ RF/Wireless ]
• VME SBC promises 1,926MIPS (2006-09-27) [ Embedded Systems ]
• Epson Toyocom develops 'ultracompact' TCXO, SPXO (2006-09-27) [ Amplifying/Conditioning/Converting ]

• USB controller LSI supports high-speed USB 2.0 (2006-09-27) [ Interface Design ]
• Ultratech releases new AP lithography tools (2006-09-27) [ EDA/IC Design ]
• National rolls out 'first' 200V stereo driver (2006-09-27) [ Amplifying/Conditioning/Converting ]
• Spansion touts first 4-bit-per-cell flash memory (2006-09-27) [ Buffer/Storage ]
• Sony reorganizes electronics biz (2006-09-27) [ Process/Manufacturing ]

• IR signs foundry agreement with Tower Semi (2006-09-27) [ Process/Manufacturing ]
• Qualcomm, India's HCL ink 3G CDMA license agreement (2006-09-27) [ RF/Wireless ]
• Q2 small display sales fell 3% (2006-09-27) [ Process/Manufacturing ]
• Analyst warns IC downturn by mid-2007 (2006-09-27) [ EDA/IC Design ]
• ASML to spend $300M on Taiwan R&D center, says report (2006-09-27) [ Process/Manufacturing ]

• China, India to dominate IC industry, forecasts Gartner (2006-09-27) [ Process/Manufacturing ]
• IEEE preps Li-ion battery standard (2006-09-27) [ Power Design ]
• Shin-Etsu to increase capacity to 1 million wafers/month (2006-09-27) [ Process/Manufacturing ]
• UMC's 12inch fabs running at full capacity (2006-09-27) [ Process/Manufacturing ]
• CFA approves CF+, CompactFlash Revision 4.0 (2006-09-27) [ Interface Design ]

• Pioneer files PDP patent lawsuit against SDI (2006-09-27) [ Optical Electronics and Display ]
• PCIe succeeds Advanced Switching in embedded systems (2006-09-26) [ Interface Design ]
• Motorola cellphone has lights, camera, action (2006-09-26) [ Optical Electronics and Display ]
• Charger accessory provides over 95Wh of continuous run-time (2006-09-26) [ Power Design ]
• Researchers announce sugar-cube sized video projector (2006-09-26) [ Optical Electronics and Display ]

• China's electronic component import/export jumps 31% in 1H (2006-09-26) [ Process/Manufacturing ]
• embWiSe to demo Linux CE-ATA software stack/driver at IDF (2006-09-26) [ Buffer/Storage ]
• Comeq, Unitech expect 36% increase on handset PCB shipments (2006-09-26) [ Process/Manufacturing ]
• Newly-patented wireless IP focuses on terrorist threat (2006-09-26) [ Sensor Technology ]
• Fujitsu enables one-third image compression rate in cars (2006-09-26) [ Digital Signal Processing ]

• Semis to grow, IC-equipment to fall in Q4 (2006-09-26) [ Process/Manufacturing ]
• Slower electronics growth threatening Asia (2006-09-26) [ Process/Manufacturing ]
• Conferences show advances in flash memory security (2006-09-26) [ Buffer/Storage ]
• Indian design firms prefer time, material model (2006-09-26) [ EDA/IC Design ]
• India's Videocon to acquire digital imaging company (2006-09-26) [ Process/Manufacturing ]

• IR thermometer eases remote temperature monitoring (2006-09-26) [ Design Test ]
• Driver module loads up to 60W for high bright LEDs (2006-09-26) [ Optical Electronics and Display ]
• STMicro rolls out 8bit MCUs for automotive apps (2006-09-26) [ Control Design ]
• Power supply sequencer targets telecom apps (2006-09-26) [ Power Design ]
• Antireflection-coated ball lenses come in larger sizes (2006-09-26) [ Optical Electronics and Display ]

• Sipex offers downloadable simulator for PowerBlox ICs (2006-09-26) [ EDA/IC Design ]
• National unveils 2nd-gen PowerWise EMU, APC2 IP pack (2006-09-26) [ Power Design ]
• IRC adds 20W and 35W devices to power resistor line (2006-09-26) [ Power Design ]
• Oki Electric ships samples of 'smallest' MP3 decoder LSI (2006-09-26) [ Amplifying/Conditioning/Converting ]
• Tektronix, FS2 develop debug tool for Xilinx FPGAs (2006-09-26) [ Design Test ]

• Low-profile inductor rolls for voltage regulator apps (2006-09-26) [ Power Design ]
• Port protection solutions support HDMI 1.3 (2006-09-26) [ EMI/EMC Design ]
• SDK to merge HD media subsidiary (2006-09-25) [ Buffer/Storage ]
• Motorola conducts DVB-H trial in HK (2006-09-25) [ RF/Wireless ]
• August panel shipment saw sharpest monthly growth in 2006 (2006-09-25) [ Process/Manufacturing ]

• Softswitch market to reach $12.6B in 2012, reports Frost & Sullivan (2006-09-25) [ Interface Design ]
• TI, ADEL co-develop fingerprint ID processor (2006-09-25) [ Sensor Technology ]
• MPS to pay Micrel $3M over patent dispute (2006-09-25) [ Process/Manufacturing ]
• Govt, industry leaders renew calls to study nanotech risks (2006-09-25) [ Process/Manufacturing ]
• Huawei reconsiders India plans, says report (2006-09-25) [ Process/Manufacturing ]

• Consortium formed to promote microdisplay-based TVs (2006-09-25) [ Optical Electronics and Display ]
• Chinese DTV makers form alliance to reduce patent payments (2006-09-25) [ Process/Manufacturing ]
• New PV relays offer smaller footprint (2006-09-25) [ Power Design ]
• Dual-interface MCU features 66Kbyte EEPROM (2006-09-25) [ Buffer/Storage ]
• Exar unveils UARTs for battery-operated consumer devices (2006-09-25) [ RF/Wireless ]

• VGA SoC image sensor integrates advanced ISP algorithms (2006-09-25) [ Sensor Technology ]
• Window comparators for ATE apps deliver faster throughput (2006-09-25) [ Amplifying/Conditioning/Converting ]
• GateFlow module includes wideband DDC IP core (2006-09-25) [ EDA/IC Design ]
• 512Kbit FRAM offers 1MHz bus speed, 10 billion cycles (2006-09-25) [ Buffer/Storage ]
• Radio network analyzers can scan several networks in parallel (2006-09-25) [ Design Test ]

• New version of LCD switch consumes less power (2006-09-25) [ Optical Electronics and Display ]
• POL modules deliver 40W (2006-09-25) [ Programmable Logic ]
• Maplesoft offers Matlab toolbox (2006-09-25) [ Embedded Systems ]
• FPGAs include SerDes, PCS block (2006-09-25) [ Programmable Logic ]
• Microchip rolls out lower-cost entry point 8bit MCUs (2006-09-25) [ Control Design ]

• IRICO, Changhong Electric begin construction of PDP facility in Sichuan (2006-09-22) [ Process/Manufacturing ]
• ST Nomadik processors feature Mentor's Nucleus Mobile OS (2006-09-22) [ Embedded Systems ]
• Synopsys, Nikon co-develop 45nm solutions (2006-09-22) [ Process/Manufacturing ]
• Freescale's new India center to focus on software R&D (2006-09-22) [ RF/Wireless ]
• NI, BAE and PMI to develop PXI Express-based synthetic instrument (2006-09-22) [ Test/Packaging ]

• Fujitsu licenses MoSys IT-SRAM tech for 65nm process (2006-09-22) [ Buffer/Storage ]
• Japan's SEH to spend $1B on wafer expansion (2006-09-22) [ Process/Manufacturing ]
• India eyes 3G rollout by 2012 (2006-09-22) [ RF/Wireless ]
• Strong 2H shaping up for large TFT-LCD panels, forecasts iSuppli (2006-09-22) [ Process/Manufacturing ]
• 2008 may bring 20% IC growth, says analyst (2006-09-22) [ Process/Manufacturing ]

• Freescale partners with Elmos on ASSP development (2006-09-22) [ Embedded Systems ]
• Catalyst Semicon beefs up analog roadmap (2006-09-22) [ Amplifying/Conditioning/Converting ]
• Battery charger touts extra measure of safety (2006-09-22) [ Security Design ]
• Power supply software reduces test time (2006-09-22) [ Design Test ]
• PCI mezzanine card delivers FPDP II performance (2006-09-22) [ Networking Design ]

• Frame grabber captures 720 x 480pixel video at 30fps (2006-09-22) [ Optical Electronics and Display ]
• DWDM FTTx transport platform delivers 20Gbps (2006-09-22) [ Optical Electronics and Display ]
• BI Tech power resistor is rated to 20W (2006-09-22) [ Power Design ]
• NXP integrates WUSB in new device controller (2006-09-22) [ RF/Wireless ]
• AC switch cuts component count by 80% (2006-09-22) [ Amplifying/Conditioning/Converting ]

• PGI integrates Fortran compilers with Microsoft Visual Studio (2006-09-22) [ Embedded Systems ]
• IDT jitter attenuator supports PCIe (2006-09-22) [ Amplifying/Conditioning/Converting ]
• Motor driver's built-in translator enables easy operation (2006-09-22) [ Power Design ]
• PoE tools enable full remote power to IP security cams (2006-09-21) [ Networking Design ]
• Agilent upgrades PCIe validation, compliance tool (2006-09-21) [ Design Test ]

• 3U cPCI backplanes come in different slot sizes (2006-09-21) [ Embedded Systems ]
• Programmer rolls for Cell BE processor (2006-09-21) [ Control Design ]
• DFM tool implements yield improvement at design stage (2006-09-21) [ EDA/IC Design ]
• Spice circuit simulator speeds time-to-results (2006-09-21) [ Embedded Systems ]
• Low-power stereo DAC delivers high audio quality (2006-09-21) [ Amplifying/Conditioning/Converting ]

• SiGe rolls out 'first' Galileo-ready receiver (2006-09-21) [ RF/Wireless ]
• Atmel unrolls low-cost development kit for AVR MCUs (2006-09-21) [ Embedded Systems ]
• Low-power post amp features sensitive LOS detection (2006-09-21) [ Amplifying/Conditioning/Converting ]
• Coaxial connector suits small, thin mobile devices (2006-09-21) [ Networking Design ]
• Quad-output PMUs ease design and save space (2006-09-21) [ Power Design ]

• Zilker Labs teams up with Avnet in Asia (2006-09-21) [ Process/Manufacturing ]
• DRAM contract price to sustain growth through Oct, says DRAMeXchange (2006-09-21) [ Buffer/Storage ]
• Actions Semi optimistic for U.S. market despite patent loss (2006-09-21) [ Embedded Systems ]
• Motorola to buy Symbol Tech for $3.9B (2006-09-21) [ Process/Manufacturing ]
• Fab in Sharp's Kameyama plant features "environmental design" (2006-09-21) [ Process/Manufacturing ]

• India reportedly delaying Huawei expansion (2006-09-21) [ Process/Manufacturing ]
• IMF warns possible Asian electronics slowdown (2006-09-21) [ Process/Manufacturing ]
• Toshiba (also) recalls laptop batteries (2006-09-21) [ Power Design ]
• Intel, UCSB researchers build 'first' hybrid silicon laser (2006-09-21) [ Optical Electronics and Display ]
• Infineon power semicon biz outperformed global market, reports IMS Research (2006-09-21) [ Process/Manufacturing ]

• Synopsys donates power management tech to Accellera (2006-09-21) [ EDA/IC Design ]
• Shipment of phone displays in Q2 saw no growth, says reports (2006-09-21) [ Optical Electronics and Display ]