• Addressing the hidden embedded software crisis in the industry (2007-06-08) [ Design Test ]
• Apple TV animates living room experience (2007-06-08) [ Digital Signal Processing ]
• Xilinx marks production qualification milestone of Virtex-5 devices (2007-06-08) [ Programmable Logic ]
• Google buys startup doing multicore programming (2007-06-08) [ Embedded Systems ]
• Broadcom joins ranks of top 3G tech suppliers (2007-06-08) [ RF/Wireless ]

• Agilent boosts investment in RF/microwave design (2007-06-08) [ EDA/IC Design ]
• Wii outsells PS3 in Japan, 5:1 (2007-06-08) [ Embedded Systems ]
• Gaming platforms: A goldmine for designers (2007-06-08) [ Embedded Systems ]
• Awards to recognize stellar electronic products from Asia (2007-06-08) [ Process/Manufacturing ]
• In-Stat: Portable connectivity spurs Wi-Fi chipset growth (2007-06-08) [ RF/Wireless ]

• Time apt for cars' electronic makeover, says GM exec (2007-06-08) [ Networking Design ]
• Indicators point to AMD as Angstrem's partner in 130nm fab (2007-06-08) [ Process/Manufacturing ]
• TD-SCDMA-to-GSM handover demoed in China (2007-06-08) [ RF/Wireless ]
• Signal analyzers offer high accuracy measurement (2007-06-08) [ Test/Packaging ]
• Single-chip embedded Ethernet MCU debuts (2007-06-08) [ EMI/EMC Design ]

• Gateway platforms support FTTH, FTTN technologies (2007-06-08) [ Optical Electronics and Display ]
• Small DACs feature selectable internal reference (2007-06-08) [ Amplifying/Conditioning/Converting ]
• EDA platform offers faster RF module design, verification (2007-06-08) [ Embedded Systems ]
• Compact Serdes boasts low power, saves board space (2007-06-08) [ RF/Wireless ]
• Chips roll for Linux embedded designs (2007-06-08) [ EMI/EMC Design ]

• Intel launches 3 Series chipsets for PCs (2007-06-08) [ Control Design ]
• 32bit dual-MAC DSP cores target 2.5G, 3G baseband (2007-06-08) [ EDA/IC Design ]
• Single-chip tuner suits high-def TV sets (2007-06-08) [ RF/Wireless ]
• DSP allows 60hrs of music playback on handsets (2007-06-07) [ RF/Wireless ]
• CMOS LDO regulators offer low quiescent current (2007-06-07) [ Power Design ]

• Contact monitor uses only 17µA supply current (2007-06-07) [ Networking Design ]
• AMD chips permit fanless embedded designs (2007-06-07) [ EMI/EMC Design ]
• USB PHY trims power in 65nm, 45nm SoC designs (2007-06-07) [ EDA/IC Design ]
• Intel updates compiler tools for multicore CPUs (2007-06-07) [ Embedded Systems ]
• WLAN module boosts home connectivity (2007-06-07) [ RF/Wireless ]

• Packet optical networking tool is multifunctional (2007-06-07) [ Digital Signal Processing ]
• Design lib for LCD driver chips debuts (2007-06-07) [ EMI/EMC Design ]
• Processor blade has dual 4Gbps Fibre Channel links (2007-06-07) [ Networking Design ]
• Intel, Asustek bare $200 laptop plan (2007-06-07) [ Embedded Systems ]
• Ministry finds China's MP3 players below par (2007-06-07) [ Process/Manufacturing ]

• TSMC channels 'Flow' to deal with 45nm design challenges (2007-06-07) [ Process/Manufacturing ]
• Toshiba taps HD DVD, flash memory in laptop strategy (2007-06-07) [ Buffer/Storage ]
• Another iPhone clone? Smart phones get free ride on hype (2007-06-07) [ RF/Wireless ]
• iPhone hype heats up as launch nears (2007-06-07) [ RF/Wireless ]
• Confusion clouds China DTV spec (2007-06-07) [ Amplifying/Conditioning/Converting ]

• ITU nod nudges WiMAX closer to 4G (2007-06-07) [ RF/Wireless ]
• Russian fab partners with U.S. firm for 130nm move (2007-06-07) [ Process/Manufacturing ]
• EIA backs amendment empowering employers on H-1B visas (2007-06-07) [ EDA/IC Design ]
• 100Gbit network IC has integrated traffic manager (2007-06-06) [ Networking Design ]
• Mixed-signal IC for motion, power management rolls (2007-06-06) [ EMI/EMC Design ]

• 1/8 brick DC/DC module ups system power performance (2007-06-06) [ Amplifying/Conditioning/Converting ]
• LDMOS RF power transistor delivers 1kW output (2007-06-06) [ Power Design ]
• HD DVD-RW drive for laptops slims down (2007-06-06) [ Buffer/Storage ]
• MicroTCA power modules figure in expanded D-sub fam (2007-06-06) [ Networking Design ]
• Test suite steps up carrier Ethernet reliability (2007-06-06) [ Test/Packaging ]

• Codec enhances voice recording in digital cameras (2007-06-06) [ Digital Signal Processing ]
• 10bit video digitizer achieves up to 165Msps speed grades (2007-06-06) [ Digital Signal Processing ]
• DSCs offer single-precision floating-point-units (2007-06-06) [ Digital Signal Processing ]
• Tool allows full visibility into FPGA-based ASIC prototyping (2007-06-06) [ Design Test ]
• DTV soon to dazzle Hong Kong couch potatoes (2007-06-06) [ RF/Wireless ]

• Sanyo, MediaTek settle patent dispute (2007-06-06) [ Optical Electronics and Display ]
• Hitachi, Oracle unite vs. piracy in China (2007-06-06) [ Sensor Technology ]
• Flextronics acquires rival Solectron for $3.6B (2007-06-06) [ Process/Manufacturing ]
• Mark that calendar, June 29 is iPhone day (2007-06-06) [ RF/Wireless ]
• R&D partnership tackles nanostructure fabrication (2007-06-06) [ Process/Manufacturing ]

• China's AVS wins Broadcom, Conexant support (2007-06-06) [ Amplifying/Conditioning/Converting ]
• Analysis: Safety apps rev automotive chip market (2007-06-06) [ Sensor Technology ]
• Is Cadence thinking of traversing the private route? (2007-06-06) [ EDA/IC Design ]
• Report: TSMC, Hynix in discussion over $1B fab purchase (2007-06-06) [ Process/Manufacturing ]
• Mini-PCI design kit for WiMAX equipment debuts (2007-06-05) [ Networking Design ]

• Tiny SAW resonator serves in comms apps (2007-06-05) [ RF/Wireless ]
• Battery IC combines cell balancing, overcurrent protection (2007-06-05) [ Power Design ]
• 3-in-1 chipset supports DTT reception in PCs (2007-06-05) [ RF/Wireless ]
• Amplifier gives mobile phones 3D audio effects (2007-06-05) [ Amplifying/Conditioning/Converting ]
• Module brings GPS functionality in handsets (2007-06-05) [ RF/Wireless ]

• Buck regulators tackle multiple current requirements (2007-06-05) [ Power Design ]
• Expanded MCU family eyes car, home audio apps (2007-06-05) [ Control Design ]
• Multifunctional tester simplifies signal analysis (2007-06-05) [ Test/Packaging ]
• DRAM gain stirs Asian chip stock rally (2007-06-05) [ Buffer/Storage ]
• LG.Philips backtracks on 5.5 generation plan (2007-06-05) [ Process/Manufacturing ]

• TSMC eyes 2009 for 32nm jump (2007-06-05) [ Process/Manufacturing ]
• Synthetic quartz crystal resists laser light longer (2007-06-05) [ Process/Manufacturing ]
• New communications satellite lifts off from China (2007-06-05) [ RF/Wireless ]
• Synplicity acquires Swedish ASIC prototyping firm (2007-06-05) [ Programmable Logic ]
• Taiwan's miCard: The memory card to end all memory cards? (2007-06-05) [ Buffer/Storage ]

• China implements universal cellphone charger (2007-06-05) [ Power Design ]
• Intel turns to Colorado this time, opens design center (2007-06-05) [ EDA/IC Design ]
• Fluctuating forecasts muddle chipmakers' plans (2007-06-05) [ Process/Manufacturing ]
• Clock module has four-line serial interface (2007-06-04) [ Interface Design ]
• Demodulator suits WiMAX, WiBro apps (2007-06-04) [ RF/Wireless ]

• Optical controller simplifies GPON transceiver designs (2007-06-04) [ Control Design ]
• TCP/IP protocol stack targets embedded systems (2007-06-04) [ Networking Design ]
• Cooling fan handles airflow, static pressure (2007-06-04) [ EMI/EMC Design ]
• RF control devices enable remote keyless entry (2007-06-04) [ RF/Wireless ]
• New interconnects, signal integrity devices roll (2007-06-04) [ EDA/IC Design ]

• Quad op amp delivers low offset (2007-06-04) [ Amplifying/Conditioning/Converting ]
• Software optimized for echo cancellation debuts (2007-06-04) [ Digital Signal Processing ]
• HDTV STB supports wireless IPTV standard (2007-06-04) [ RF/Wireless ]
• Maximize your PC's energy efficiency (2007-06-04) [ Power Design ]
• In notebook webcams, less pixels means more performance (2007-06-04) [ Digital Signal Processing ]

• Dell, Motorola, IBM announce more job cuts (2007-06-04) [ Process/Manufacturing ]
• UDC, LG.Philips hammer PHOLED tech share deal (2007-06-04) [ Optical Electronics and Display ]
• Gartner slashes chip industry outlook (2007-06-04) [ Process/Manufacturing ]
• LG gives digital display business a facelift (2007-06-04) [ Optical Electronics and Display ]
• 'Fab Club' welcomes two European members (2007-06-04) [ Process/Manufacturing ]

• Triumvirate heralds use of flash in PCs, works on standard (2007-06-04) [ Buffer/Storage ]
• Coffee and PC mix with Microsoft Surface (2007-06-04) [ Interface Design ]
• China chip market cooling down in next two years (2007-06-04) [ EDA/IC Design ]
• Motorola opens R&D site in Israel (2007-06-04) [ EDA/IC Design ]
• TSMC partners with foundry R&D firm (2007-06-04) [ Process/Manufacturing ]

• Build a hybrid IPTV-DTV/DVB STB (2007-06-01) [ Amplifying/Conditioning/Converting ]
• System LSI chips tailored for STBs with hard drives (2007-06-01) [ RF/Wireless ]
• Transistor manages 300W over full UHF band (2007-06-01) [ RF/Wireless ]
• Solid state relays deliver high throughput (2007-06-01) [ Networking Design ]
• Devices retain logic states even without power (2007-06-01) [ Programmable Logic ]

• SoC suits high-performance car navigation systems (2007-06-01) [ Interface Design ]
• Power amp drives ceramic speaker at higher voltages (2007-06-01) [ Amplifying/Conditioning/Converting ]
• 3-channel LED driver promises stability, efficiency (2007-06-01) [ Amplifying/Conditioning/Converting ]
• Receiver handles terrestrial, CS digital broadcasting (2007-06-01) [ RF/Wireless ]
• PFC control circuit rolls for 75-800W apps (2007-06-01) [ Power Design ]

• Multichip package's capacity swells to 4Gbyte (2007-06-01) [ Test/Packaging ]
• Fractal antenna aids design of tiny handsets (2007-06-01) [ RF/Wireless ]
• System board is ultrasmall at 16.7cm² (2007-06-01) [ EDA/IC Design ]
• Micron CEO: Of memories and foundry models (2007-06-01) [ Optical Electronics and Display ]
• Let software catch up with silicon (2007-06-01) [ Embedded Systems ]

• Design with serial EEPROM devices (2007-06-01) [ EDA/IC Design ]
• Cut your design time with multiproject wafer services (2007-06-01) [ EDA/IC Design ]
• Performing SE design with digital audio amps (2007-06-01) [ Amplifying/Conditioning/Converting ]
• DirectDrive delivers better audio quality (2007-06-01) [ Amplifying/Conditioning/Converting ]
• Sound advice on Class D audio amps designs (2007-06-01) [ EMI/EMC Design ]

• Library Compiler supports CCS models (2007-06-01) [ EDA/IC Design ]
• XA offers better simulation accuracy (2007-06-01) [ EDA/IC Design ]
• BIOS solutions go for system-specific apps (2007-06-01) [ Embedded Systems ]
• All-in-OneMemory packs NOR, NAND, RAM (2007-06-01) [ Buffer/Storage ]
• Lower-voltage DDR2 DRAMs target data center apps (2007-06-01) [ Buffer/Storage ]

• Board offers direct LCD panel operation (2007-06-01) [ Optical Electronics and Display ]
• Analog front-end targets mobile ultrasound (2007-06-01) [ Sensor Technology ]
• Hearing aids get makeover with wireless (2007-06-01) [ RF/Wireless ]
• MEMS chips integrate more intelligence (2007-06-01) [ Sensor Technology ]
• Is India the next China? (2007-06-01) [ EDA/IC Design ]

• IBM gets on the road to 3D packaging (2007-06-01) [ Test/Packaging ]
• IC designers favor less complex DFM (2007-06-01) [ EDA/IC Design ]
• HDTV interface spec sparks product rollouts (2007-06-01) [ Programmable Logic ]
• Image sensor trims cost of car vision systems (2007-06-01) [ Sensor Technology ]
• Prius drives with smart GPS navigation system (2007-06-01) [ RF/Wireless ]

• Check interconnections between FPGAs on a high-density board (2007-06-01) [ Programmable Logic ]